Fushi Technology raises $60m to expand advanced semiconductor manufacturing

Chinese semiconductor company Fushi Technology has completed a $60m Series C funding round backed by investors including Xintong Electronics, Jingce Electronics and Huarui Investment. The company develops advanced lidar receiver chips and 3D spatial sensing technology used in automotive systems and other intelligent devices. HPC could identify semiconductor manufacturers, automotive technology companies, component distributors and international investors interested in the growing artificial intelligence hardware market.

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